Product Overview
HC-1650 is a 50 μm alkaline-developable photoresist film for selective electroless nickel/gold (Ni/Au) plating.
It is formulated for high-temperature electroless plating environments, with resistance to electroless Ni/Au chemistry. The film is intended to reduce bath contamination and support production efficiency and yield.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 50 μm |
| Film Width | 150–800 mm; slit to the specified width |
| Film Length | 492 ft (150 m) |
| Photosensitivity | 85 mJ/cm² |
| Minimum Developing Time | 50 s |
| Resolution (ST = 5/21) | 40 μm |
| Resolution (ST = 6/21) | 50 μm |
| Resolution (ST = 7/21) | 80 μm |
| Adhesion (ST = 5/21) | 35 μm |
| Adhesion (ST = 6/21) | 30 μm |
| Adhesion (ST = 7/11) | 30 μm |
Key Features
High-Temperature Capability
Suitable for demanding electroless plating conditions.
Ni/Au Chemical Resistance
Designed for selective electroless nickel/gold processes.
Lower Bath Contamination
Helps reduce contamination of the electroless Ni/Au solution.
Applications
Selective electroless nickel/gold plating processes for PCB and related electronic manufacturing.