Product Overview
HC-1538B is a high-sensitivity, 38 μm dry film photoresist optimized from HC-1538 for heavy copper plating processes.
Designed for use on both standard LED exposure equipment and LDI (Laser Direct Imaging) exposure systems, HC-1538B helps improve imaging throughput while maintaining pattern integrity during copper plating.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 38 μm |
| Exposure Energy (SST = 7/21) | 25 mJ/cm² |
| Sensitivity (21ST) | 7 ± 1 |
| Resolution (SST = 7/21) | 55 μm |
| Adhesion (SST = 7/21) | 40 μm |
| Stripping Time (5% NaOH, 50 °C) | 50 s |
Key Features
Optimized Photosensitivity
Supports both standard LED exposure and LDI exposure systems.
Heavy Copper Plating Performance
Designed to help maintain image integrity during heavy copper plating.
Production Efficiency
Enables lower-energy imaging and efficient processing.
Applications
Heavy copper PCB plating, plated-through-hole processes, and LDI or standard LED imaging lines.