Product Overview
HD-7240 is a 38 μm alkaline-developable dry film photoresist for outer-layer circuit formation on hard boards using LDI.
It combines high photosensitivity, rapid low-energy imaging, strong adhesion, high resolution, and high PE film strength. Compared with HD-7540, it offers faster stripping and higher film dissolution capacity to support efficient high-density outer-layer production.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 38 μm |
| Exposure Energy (SST = 7/21) | 20 mJ/cm² |
| Sensitivity (21ST) | 7 ± 1 |
| Resolution (SST = 6/21) | 40 μm |
| Adhesion (SST = 6/21) | 45 μm |
| Stripping Time (3% NaOH, 50 °C) | 55 s |
Key Features
LDI Ready
Developed for laser direct imaging on hard-board outer layers.
Low-Energy Rapid Imaging
High photosensitivity supports efficient image formation.
Efficient Stripping
Offers faster stripping and higher dissolution capacity than HD-7540.
Applications
LDI imaging for high-density hard-board outer-layer circuit formation, anti-plating, and direct etching.