Product Overview
HD-7545 is an LDI direct-imaging dry film photoresist engineered for thick-copper plated rigid PCBs.
It combines robust electroplating resistance and strong hole-covering performance with high photosensitivity, low-energy imaging, high adhesion, reliable resolution, and a durable PE cover film. HD-7545 is designed to support stable production in demanding thick-copper plating processes.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 45 μm |
| Exposure Energy (SST = 7/21) | 20 mJ/cm² |
| Sensitivity (21ST) | 7 ± 1 |
| Resolution (SST = 6/21) | 50 μm |
| Adhesion (SST = 6/21) | 55 μm |
| Stripping Time (3% NaOH, 50 °C) | 70 s |
Key Features
Reliable Thick-Copper Plating Resistance
Formulated for stable performance in thick-copper plating workflows.
Strong Hole-Covering Performance
Helps support consistent coverage across PCB features during imaging and plating.
Fast, Low-Energy LDI Imaging
High photosensitivity supports rapid imaging at 20 mJ/cm² (SST = 7/21).
High Adhesion and Resolution
Delivers 55 μm adhesion and 50 μm resolution (SST = 6/21) for stable pattern definition.
Durable PE Cover Film
A high-strength PE cover film supports reliable handling and process consistency.
Applications
Thick-copper plated rigid PCBs, LDI direct-imaging workflows, and applications requiring stable electroplating resistance, strong hole coverage, and dependable imaging performance.