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LDI Hard Board Dry Film Photoresist HD-7240

Product Overview

HD-7240 dry film photoresist rolls

HD-7240 is a 38 μm alkaline-developable dry film photoresist for outer-layer circuit formation on hard boards using LDI.

It combines high photosensitivity, rapid low-energy imaging, strong adhesion, high resolution, and high PE film strength. Compared with HD-7540, it offers faster stripping and higher film dissolution capacity to support efficient high-density outer-layer production.

Technical Specifications

HD-7240 LDI hard board dry film photoresist micrograph
Technical ParameterTypical Value
Dry Film Thickness38 µm
Exposure Energy (SST = 7/21)20 mJ/cm²
Sensitivity (21ST)7 ± 1
Developing Time30–40 s
Resolution (SST = 6/21)40 µm
Adhesion (SST = 6/21)45 µm
Stripping Condition3% NaOH, 50°C, 55 s
Available Dry Film Width150–800 mm
Dry Film Length492 ft (150 m)
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HD-7240 Technical Data Sheet · PDF · Receive your private download link by email

Key Features

LDI Ready

Developed for laser direct imaging on hard-board outer layers.

Low-Energy Rapid Imaging

High photosensitivity supports efficient image formation.

Efficient Stripping

Offers faster stripping and higher dissolution capacity than HD-7540.

Applications

LDI imaging for high-density hard-board outer-layer circuit formation, anti-plating, and direct etching.

Product Format & Dimensions

ItemSpecification
Dry film thickness38 µm
Available dry film width150–800 mm; slit to the specified width
Standard dry film length656 ft (200 m)

Recommended Processing Conditions

StepRecommended condition
Board pre-treatmentRemove debris, oil and oxides; rinse and dry.
LaminationRoll temperature 110 ± 10°C; pressure 4–5 kg; manual speed 1.0–1.5 m/min or automatic speed 2.0–3.0 m/min.
Hold before exposureUnder yellow/orange safe light: 20 ± 2°C, 60 ± 10% RH, 5 min to 24 h; keep boards upright.
ExposureLaser direct imaging is recommended; LED or mercury lamp may also be used. Use a 21-step exposure guide at 6–8 steps.
Development0.8–1.2% anhydrous sodium carbonate at 30 ± 2°C; spray pressure 0.12–0.20 MPa.
Stripping3–5 wt% sodium hydroxide at 50 ± 5°C; spray pressure ≥ 0.2 MPa.

Safety & Storage Guidelines

  • Use appropriate safe lighting and avoid prolonged light exposure.
  • Avoid direct contact with the photosensitive layer. Provide adequate exhaust during lamination and wear eye and hand protection for alkaline chemicals.
  • Store horizontally at 5–20°C and 40–60% RH; protect unused material in black packaging and use within 60 days.

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