HC-1540 is a high-resolution dry film photoresist designed for precision circuitry and fine-pattern PCB manufacturing. It provides strong adhesion, high imaging resolution, and a wide, stable operating range, supporting accurate pattern formation and consistent processing performance. Its water-soluble development system enables efficient and clean processing.
Technical Specifications
Technical Parameter
Typical Value
Dry Film Thickness
38 µm
Diffuse Exposure Energy
60 mJ/cm² (50–70 mJ/cm²)
Collimated Exposure Energy
53 mJ/cm² (38–74 mJ/cm²)
Developing Conditions
0.8–1.2% Na₂CO₃, 30 ± 2°C, 30–40 s minimum
Resolution
40 µm
Adhesion
35 µm
Stripping Condition
5% NaOH, 50°C, 60 s
PE Film Strength
6 N/m
Key Features
High Resolution： Supports fine-line pattern formation for flexible PCB and high-density circuit applications.
Excellent Photosensitivity： Provides consistent exposure performance for reliable image transfer during PCB manufacturing.
Strong Adhesion： Provides good adhesion to the substrate, helping maintain pattern integrity during processing.
Fast Exposure Response： Supports efficient exposure processes and stable production performance.
Water-Soluble Development： Designed for water-soluble development to support efficient and clean processing.
Product Format & Dimensions
Item
Specification
Dry film thickness
38 µm
Available dry film width
200–600 mm; slit to the specified width
Standard dry film length
656 ft (200 m)
Recommended Processing Conditions
Step
Recommended condition
Board pre-treatment
Remove debris, oil and oxides; rinse and dry. Non-woven fabric and pumice treatment may be used.
Lamination
Roll temperature 110 ± 10°C; pressure 4–5 kg; manual speed 1.0–1.5 m/min or automatic speed 2.0–3.0 m/min.
Hold before exposure
Under orange safe light: 20 ± 2°C, 60 ± 10% RH, 5 min.
Exposure
Use a 21-step exposure guide at 6–8 steps; suitable exposure sources include mercury lamp and LED.
Use the product only under appropriate safety lighting; avoid direct sunlight and prolonged exposure to white light.
Avoid direct contact with the photosensitive layer. If contact occurs, wash thoroughly; if it enters the eyes, rinse with water and seek medical attention.
Use local or general exhaust during lamination. Wear suitable eye and hand protection when handling alkaline developer or stripper.
Store horizontally in a cool, dry place at 5–20°C and 40–60% RH. Use within 60 days.
