Product Overview
HC-1538 is a dry film photoresist designed for heavy copper and copper plating applications. It provides strong adhesion, high resolution, and good resistance during copper plating processes, helping maintain pattern integrity and imaging quality throughout PCB manufacturing. The water-soluble development system supports efficient and clean processing.
Technical Specifications
| Technical Parameter | Typical Value |
|---|---|
| Dry Film Thickness | 38 µm |
| Diffuse Exposure Energy | 50 mJ/cm² (40–60 mJ/cm²) |
| Collimated Exposure Energy | 48 mJ/cm² (38–74 mJ/cm²) |
| Developing Conditions | 0.8–1.2% Na₂CO₃, 30 ± 2°C, 30–40 s minimum |
| Resolution | 55 µm (SST = 7/21) |
| Adhesion | 50 µm (SST = 7/21) |
| Stripping Condition | 5% NaOH, 50°C, 60 s |
| PE Film Strength | 6 N/m |
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HC-1538 Technical Data Sheet · PDF · Receive your private download link by email
Key Features
High Resolution：
Supports stable fine-line pattern definition for heavy copper PCB circuit formation.
Excellent Photosensitivity：
Provides consistent exposure performance for reliable image transfer during PCB manufacturing.
Strong Adhesion：
Provides good adhesion to the substrate, helping maintain pattern integrity during processing.
Fast Exposure Response：
Supports efficient exposure processes and stable production performance.
Water-Soluble Development：
Designed for water-soluble development with clean and efficient processing.
Product Format & Dimensions
| Item | Specification |
|---|---|
| Dry film thickness | 38 µm |
| Available dry film width | 200–800 mm; slit to the specified width |
| Standard dry film length | 656 ft (200 m) |
Recommended Processing Conditions
| Step | Recommended condition |
|---|---|
| Board pre-treatment | Remove debris, oil and oxides; rinse and dry. Non-woven fabric and pumice treatment may be used. |
| Lamination | Roll temperature 110 ± 10°C; pressure 4–5 kg; manual speed 1.0–1.5 m/min or automatic speed 2.0–3.0 m/min. |
| Hold before exposure | Under orange safe light: 20 ± 2°C, 60 ± 10% RH, 5 min. |
| Exposure | Use a 21-step exposure guide at 6–8 steps; suitable exposure sources include mercury lamp, LED and laser imaging. |
| Hold after exposure | 23 ± 2°C, 60 ± 10% RH, 10–15 min. |
| Development | 0.8–1.2% anhydrous sodium carbonate at 30 ± 2°C; spray pressure 0.12–0.20 MPa. |
| Stripping | 3–5 wt% sodium hydroxide at 50 ± 5°C; spray pressure ≥ 0.2 MPa. |
Safety & Storage Guidelines
- Use the product only under appropriate safety lighting; avoid direct sunlight and prolonged exposure to white light.
- Avoid direct contact with the photosensitive layer. If contact occurs, wash thoroughly; if it enters the eyes, rinse with water and seek medical attention.
- Use local or general exhaust during lamination. Wear suitable eye and hand protection when handling alkaline developer or stripper.
- Store horizontally in a cool, dry place at 5–20°C and 40–60% RH. Use within 60 days.