Product Overview
HC-1538B is a high-sensitivity, 38 μm dry film photoresist optimized from HC-1538 for heavy copper plating processes.
Designed for use on both standard LED exposure equipment and LDI (Laser Direct Imaging) exposure systems, HC-1538B helps improve imaging throughput while maintaining pattern integrity during copper plating.
Technical Specifications
| Technical Parameter | Typical Value |
|---|---|
| Dry Film Thickness | 38 µm |
| Exposure Energy | 25 mJ/cm² (20–30 mJ/cm²) |
| Sensitivity (21ST) | 7 ± 1 |
| Developing Conditions | 0.8–1.2% Na₂CO₃, 30 ± 2°C, 35–40 s minimum |
| Resolution | 55 µm (SST = 7/21) |
| Adhesion | 40 µm (SST = 7/21) |
| Stripping Condition | 5% NaOH, 50°C, 50 s |
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HC-1538B Technical Data Sheet · PDF · Receive your private download link by email
Key Features
Optimized Photosensitivity
Supports both standard LED exposure and LDI exposure systems.
Heavy Copper Plating Performance
Designed to help maintain image integrity during heavy copper plating.
Production Efficiency
Enables lower-energy imaging and efficient processing.
Applications
Heavy copper PCB plating, plated-through-hole processes, and LDI or standard LED imaging lines.
Product Format & Dimensions
| Item | Specification |
|---|---|
| Dry film thickness | 38 µm |
| Available dry film width | 200–800 mm; slit to the specified width |
| Standard dry film length | 656 ft (200 m) |
Recommended Processing Conditions
| Step | Recommended condition |
|---|---|
| Board pre-treatment | Remove debris, oil and oxides; rinse and dry. Non-woven fabric and pumice treatment may be used. |
| Lamination | Roll temperature 110 ± 10°C; pressure 4–5 kg; manual speed 1.0–1.5 m/min or automatic speed 2.0–3.0 m/min. |
| Hold before exposure | Under orange safe light: 20 ± 2°C, 60 ± 10% RH, 5 min. |
| Exposure | Use a 21-step exposure guide at 6–8 steps; suitable for standard LED and LDI exposure systems. |
| Hold after exposure | 23 ± 2°C, 60 ± 10% RH, 10–15 min. |
| Development | 0.8–1.2% anhydrous sodium carbonate at 30 ± 2°C; spray pressure 0.12–0.20 MPa. |
| Stripping | 3–5 wt% sodium hydroxide at 50 ± 5°C; spray pressure ≥ 0.2 MPa. |
Safety & Storage Guidelines
- Use the product only under appropriate safety lighting; avoid direct sunlight and prolonged exposure to white light.
- Avoid direct contact with the photosensitive layer. If contact occurs, wash thoroughly; if it enters the eyes, rinse with water and seek medical attention.
- Use local or general exhaust during lamination. Wear suitable eye and hand protection when handling alkaline developer or stripper.
- Store horizontally in a cool, dry place at 5–20°C and 40–60% RH. Use within 60 days.