Product Overview
HD-7540 is a 38 μm dry film photoresist for LDI imaging, anti-plating, and direct etching on hard boards.
It provides high adhesion and high resolution for stable pattern formation. The product is suitable for hard-board anti-plating and direct corrosion processes, with reliable stripping performance and laser direct imaging capability.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 38 μm |
| Exposure Energy (SST = 7/21) | 14 mJ/cm² |
| Sensitivity (21ST) | 7 ± 1 |
| Resolution (SST = 6/21) | 45 μm |
| Adhesion (SST = 6/21) | 50 μm |
| Stripping Time (3% NaOH, 50 °C) | 60 s |
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HD-7540 Technical Data Sheet · PDF · Receive your private download link by email
Key Features
LDI Compatible
Supports laser direct imaging with stable patterning performance.
High Adhesion
Helps preserve pattern definition during anti-plating and etching.
High Resolution
Suitable for hard-board circuit imaging applications.
Applications
Hard-board anti-plating, direct etching, LDI imaging, and circuit pattern formation.
Product Format & Dimensions
| Item | Specification |
|---|---|
| Dry film thickness | 38 µm |
| Available dry film width | 150–800 mm; slit to the specified width |
| Standard dry film length | 656 ft (200 m) |
Recommended Processing Conditions
| Step | Recommended condition |
|---|---|
| Board pre-treatment | Remove debris, oil and oxides; rinse and dry. |
| Lamination | Roll temperature 110 ± 10°C; pressure 4–5 kg; manual speed 1.0–1.5 m/min or automatic speed 2.0–3.0 m/min. |
| Hold before exposure | Under yellow/orange safe light: 20 ± 2°C, 60 ± 10% RH, 5 min to 24 h; keep boards upright. |
| Exposure | Laser direct imaging is recommended; LED or mercury lamp may also be used. Use a 21-step exposure guide at 6–8 steps. |
| Development | 0.8–1.2% anhydrous sodium carbonate at 30 ± 2°C; spray pressure 0.12–0.20 MPa. |
| Stripping | 3–5 wt% sodium hydroxide at 50 ± 5°C; spray pressure ≥ 0.2 MPa. |
Safety & Storage Guidelines
- Use appropriate safe lighting and avoid prolonged light exposure.
- Avoid direct contact with the photosensitive layer. Provide adequate exhaust during lamination and wear eye and hand protection for alkaline chemicals.
- Store horizontally at 5–20°C and 40–60% RH; protect unused material in black packaging and use within 60 days.