Product Overview
HC-1650 is a 50 μm alkaline-developable photoresist film for selective electroless nickel/gold (Ni/Au) plating.
It is formulated for high-temperature electroless plating environments, with resistance to electroless Ni/Au chemistry. The film is intended to reduce bath contamination and support production efficiency and yield.
Technical Specifications
| Properties | Parameters |
|---|---|
| Film Thickness | 50 μm |
| Film Width | 150–800 mm; slit to the specified width |
| Film Length | 492 ft (150 m) |
| Photosensitivity | 85 mJ/cm² |
| Minimum Developing Time | 50 s |
| Resolution (ST = 5/21) | 40 μm |
| Resolution (ST = 6/21) | 50 μm |
| Resolution (ST = 7/21) | 80 μm |
| Adhesion (ST = 5/21) | 35 μm |
| Adhesion (ST = 6/21) | 30 μm |
| Adhesion (ST = 7/11) | 30 μm |
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HC-1650 Technical Data Sheet · PDF · Receive your private download link by email
Key Features
High-Temperature Capability
Suitable for demanding electroless plating conditions.
Ni/Au Chemical Resistance
Designed for selective electroless nickel/gold processes.
Lower Bath Contamination
Helps reduce contamination of the electroless Ni/Au solution.
Applications
Selective electroless nickel/gold plating processes for PCB and related electronic manufacturing.
Product Format & Dimensions
| Item | Specification |
|---|---|
| Dry film thickness | 50 µm |
| Available dry film width | 150–800 mm; slit to the specified width |
| Standard dry film length | 492 ft (150 m) |
Recommended Processing Conditions
| Step | Recommended condition |
|---|---|
| Board pre-treatment | Remove debris, oil and oxides. Water rinse: 10–30 s at 0.15–0.25 MPa; dry at 30–50°C for 10–20 s. |
| Lamination | Roll temperature 110–130°C; pressure 0.3–0.5 MPa; speed 0.5–2.0 m/min. |
| Hold before exposure | Under yellow safe light: 23 ± 2°C, 60 ± 10% RH, 30 min to 48 h; keep boards upright. |
| Exposure | Use a 21-step exposure guide at 8 ± 1 steps; exposure energy 85 ± 25 mJ/cm². |
| Hold after exposure | 23 ± 2°C, 60 ± 10% RH, 15 min to 48 h. |
| Development | 1.0 ± 0.3 wt% anhydrous sodium carbonate at 30 ± 2°C; 1.5–2.5× the minimum developing time; spray pressure 0.12–0.20 MPa. |
| Post-bake | 100–160°C for 30–60 min; a 130–135°C × 30 min condition is provided as a reference. |
| Stripping | 3.0 ± 0.5 wt% sodium hydroxide at 45–55°C; 1.5–2× the minimum stripping time; spray pressure ≥ 0.1 MPa. |
Safety & Storage Guidelines
- Use only for PCB-related pattern formation. Follow applicable MSDS and process safety instructions.
- Avoid direct contact with the photosensitive layer; wear suitable eye and hand protection when handling developer and stripper.
- Store unopened material horizontally in a cool, dry place at 5–20°C and below 60% RH; use within 40 days of manufacture.
- Keep unused material in black protective film and limit exposure to safe lighting.